- 在CMakeLists.txt中添加hid_boot_event.c、keyboard_led_event.c和ble_slot_ctrl_module.c源文件 - 新增Kconfig配置项NEW_KBD_BLE_BOND_ENABLE用于启用应用特定的BLE绑定支持 - 修改prj.conf配置,禁用配对模式下的设备名称广播功能 - 重构电池状态事件结构,将charging和full布尔字段改为flags位域,并提供相应的访问函数 - 添加hid_boot_event事件类型,用于处理HID Boot协议输入报告 - 重命名keyboard_led_state_event为keyboard_led_event并改进LED状态处理逻辑 - 移除hid_protocol_event中的transport字段,简化协议事件处理 - 分离hid_report_event和hid_boot_event,明确区分Report和Boot协议报文处理 - 重构battery_module.c代码结构,改用上下文结构体管理电池模块状态 - 更新ble_battery_module.c使用新的电池状态事件访问接口
18 lines
425 B
Plaintext
18 lines
425 B
Plaintext
menu "new_kbd"
|
|
|
|
config NEW_KBD_BLE_BOND_ENABLE
|
|
bool "Enable app-specific BLE bond support"
|
|
default y
|
|
depends on BT_BONDABLE
|
|
depends on BT_SETTINGS
|
|
depends on CAF_SETTINGS_LOADER
|
|
depends on CAF_BLE_COMMON_EVENTS
|
|
select CAF_BLE_BOND_SUPPORTED
|
|
help
|
|
Inform CAF modules that the application provides its own BLE bond
|
|
implementation and advertising must wait for it to become ready.
|
|
|
|
endmenu
|
|
|
|
source "Kconfig.zephyr"
|